IEEE Region 5

Come and solder LED hearts for yourself or a loved one! We will teach you the basics of soldering and help you make something special! Bldg: Drone Lab, One Camino Santa Maria, San Antonio, Texas, United States

The IEEE Pikes Peak Section will be starting a new initiative in STEM/STEAM (Science, Technology, Engineering, Arts/Artificial Intelligence (AI), and Mathematics), led by Dr. John Santiago, past IEEE Faculty Advisor of the IEEE Colorado Technical University (CTU) Student Branch (2007-2019), IEEE Pikes Peak Section Chair (Jan 2019 – Feb 2023), IEEE PPS webmaster (2015-Present). The first monthly meeting will be held on: Date: 11 Feb 2025 Time: 5:30 pm – 7:00 pm Location: Pikes Peak Library District (PPLD) 21st Century Library, Room B6, 1175 Chapel Hills Dr. Colorado Springs, CO 80920 Snacks will be provided. The room can accommodate only a maximum of 16 people, so please register. Once 16 individuals have signed up, registration will immediately be closed. There will be other opportunities to attend these meetings and will keep track for those who are unable to attend this meeting. The end goal of these monthly meetings is to prepare 10 workstations for the ‘What-If’ Festival to be held during September 2025. Most of the workstations will leverage the past demonstrations created by former students of Dr John Santiago. The IEEE Pikes Peak Section plans to participate in other STEM/STEAM events when more details are brought forth, including: Cool Science, Engineering Summit, Space Foundation – Summer of Discovery, Job Fairs and others. The agenda includes: - Demonstrations of Squishy Circuits (making circuits with Play-Doh) o Develop STEM/STEAM kits o Demonstrate and Brainstorm other ideas/lessons using Squishy Circuits. - Description and Demos of Past Student Projects/workstations (tracking scare crows using Arduino, flying drones, simple and handmade motors, solar stem kits, and many others). - Please visit https://r5.ieee.org/stem-demos and (https://r5.ieee.org/pikespeak/student-activities/#1655832784573-d6b390a4-9f53) a - AI applications to increase productivity - Develop agenda for future monthly meetings The initiative attempts to be aligned with IEEE Region 5 priorities/goals, namely: - Build the student to Young Professional pipeline - Develop leadership among the section and active volunteers - Increase engagement with industry The above goals/priorities are also aligned with the IEEE Pikes Peak Section strategic goals developed during 2020 (https://r5.ieee.org/pikespeak/about-the-section) given as: - Enhance professional skills - Increase member engagement - Assist improvement in workforce - Invest in STEM education Speaker(s): John, Agenda: The agenda includes: - Demonstrations of Squishy Circuits (making circuits with Play-Doh) o Develop STEM/STEAM kits o Demonstrate and Brainstorm other ideas/lessons using Squishy Circuits. - Description and Demos of Past Student Projects/workstations (tracking scare crows using Arduino, flying drones, simple and handmade motors, solar stem kits, and many others). Please visit https://r5.ieee.org/pikespeak/student-activities and https://r5.ieee.org/stem-demos - AI applications to increase productivity - Develop agenda for future monthly meetings Bldg: 21st Century Library, 1175 Chapel Hills Dr., Room B6, Colorado Springs, Colorado, United States, 80920

Dr Rui Li of will take a deep dive into the Multimodal Interaction and Affective Computing Lab (MIAC Lab) at Montclair State with a focus on Multimodal Human-Machine Interaction. This exciting work involves multimodal information processing, immersive interaction, intelligent systems for vehicles and robots. Her passion is for the interdisciplinary study of human emotion, behavior, and cognition to bring about excellent human-machine interaction and intelligent machines. Speaker(s): Dr. Rui Li PhD Virtual: https://events.vtools.ieee.org/m/456316

Two Industry Professionals from Oncor are coming down to UTA to talk to IEEE-HKN Epsilon Mu about "What do engineers do at Oncor" and giving us the update on whats going on in the electrical grid. Agenda: - Introduction to our 2 guest - Tech Talk with Oncor - Last minute message Room: 108, Bldg: Nedderman Hall, 416 Yates St, Arlington, TX 76010, Arlington, Texas, United States, 76013

Abstract: As the complexity of modern computers, embedded devices, and satellites increases, so does the need for stronger cybersecurity. Government agencies are mandating cybersecurity measures for new space missions, raising concerns among technology providers. This paper discusses the growing necessity of incorporating Secure Boot to enhance satellite security. Secure Boot verifies the authenticity of an operating system or software before execution, starting with a root of trust that uses fixed keys and digital signatures for verification. While Secure Boot is commonly associated with the Unified Extensible Firmware Interface (UEFI) on consumer platforms, it is typically restricted to modern architectures. Space platforms often operate at their computational limits, and introducing Secure Boot could further reduce their processing capacity. However, implementing Secure Boot on a Field Programmable Gate Array (FPGA) can prevent the processor from sharing the computational load, minimizing the impact on overall system performance. Furthermore, applying Secure Boot enhances security by making the configuration tamper-evident after initialization, preventing unauthorized modifications to the boot process. This immutability fortifies the system’s integrity and strengthens defenses against tampering or malicious attacks. Given these challenges, dedicating an FPGA core to Secure Boot provides an effective solution. As cybersecurity demands for satellites increase, accelerating Secure Boot via an FPGA core mitigates the performance impact while significantly bolstering security. This approach addresses the unique needs of space platforms and offers a robust response to the evolving challenges of satellite cybersecurity. Talk is restricted to US Citizens. Bldg: Building 51, 6620 Culebra, San Antonio, Texas, United States, 78238

Is AI a threat to your job? Will middle management really disappear? In this talk, we’ll answer these questions and more. You’ll learn what AI really is, and the difference between Machine Learning and Deep Learning. We’ll break down popular buzzwords like ChatGPT and large language models, and explore how these technologies are shaping the workplace. As a leader, you need to be able to talk about AI—not just as a tool, but as a way to transform teams, drive innovation, and lead change. This session will give you the confidence to navigate these conversations in interviews, networking, or your current role. You’ll leave with a clear understanding of how to stay competitive, whether by upskilling or positioning yourself as a future-focused leader. Plus, discover how tailored coaching can help you leverage AI knowledge to elevate your job search and career strategy. Speaker(s): Elizabeth Lions Agenda: IEEE-USA's free webinars/events are designed to help you find your next job, maintain your career, negotiate an appropriate salary, understand ethical considerations in the workplace and learn about other career-building strategies and public policy developments that affect your profession. Learn about our sponsor: the IEEE Member Group Insurance Program - Powered by AMBA. AMBA specializes in providing tailored insurance solutions for IEEE members. Whether you’re seeking health, life, or disability coverage, AMBA has you covered. Visit the IEEE Member Group Insurance Program website to explore the benefits and options available to you: (https://www.ieeeinsurance.com/) For information regarding upcoming webinars or to visit our vast webinar archive, please visit: (https://ieeeusa.org/careers/webinars/) (https://newsletter.smartbrief.com/rest/sign-up/2479DAB0-4089-43E7-925D-86AE0C1E6244?campaign=e0d52cef) Virtual: https://events.vtools.ieee.org/m/462467

Come network with Houston area electrical engineering professionals and meet the candidates for section officers! Enjoy food and drinks courtesy of our sponsor while you meet the candidates ask them about their plans for the Houston section. Be sure to let them know your opinions and desires for the section for the next year. There are four positions being elected: Chair, Vice-Chair, Secretary, and Treasurer. The election for the IEEE Houston section officers will take place from February 5th to 20th, so you can cast your vote the same day. Big thanks to our sponsor: [] The Lynn Elliott Company (LECO) has over 80 years of experience representing the Southwest for manufacturers in the Electrical Power Industries. The reason for LECO's sustainability has to do with its core philosophy: it's not about the sale – its about the quality of the relationship. We take pride in understanding our manufacturers' products at such a high level that we offer expertise and knowledge beyond the sale. That is why our customers continue to rely on our services and why manufacturers choose us. Co-sponsored by: Lynn Elliott Company Agenda: We'll be there from 5pm to 7pm, and feel free to show up and leave whenever is convenient. Bldg: Kirby Ice House, 1015 Gessner Rd, Houston, Texas, United States, 77055

See agenda below. Agenda: Agenda Virtual: https://events.vtools.ieee.org/m/463086

Title: Interconnection Scaling – Going Big and Going Small Abstract: This presentation will cover a high-level overview of interconnections between integrated circuits – trends over the past several decades and what technologies may support future trends, along with a discussion of basic signal integrity considerations for such interconnections. Over most of the past 50 years the scaling of silicon integration was the winning hand for increased performance with packaging and interconnections scaling at substantially lower rates. Fundamental challenges in nanometer process nodes have effectively ended the steadily increasing benefits of Moore’s Law so new paradigms for 2D, 2.5D, and 3D Heterogeneous Integration packaging technologies are being proposed and developed to keep system performance scaling moving forward. Rapidly moving a lot of data between chips is fundamental to all these approaches. One approach for dense, high bandwidth interconnections will be discussed in some detail to illustrate tradeoffs and discuss the limits of how interconnections between chips can reach the limits of interconnections within chips. Co-sponsored by: University of Colorado Boulder Agenda: 6:30PM - 7:00PM Social 7:00PM - 8:00PM Technical Talk Room: KOBL 352, Bldg: Rustandy Building, 1111 Engineering Dr, Boulder, Colorado, United States, 80309

Continuing the tradition of the annual photonics workshop in Dallas Fort Worth area, 2025 UTA Photonics workshop will be held on February 14, 2025 (Friday, 8am-5pm) at the campus of the University of Texas at Arlington (UTA). The theme of 2025 photonics workshop is Chip-scale photonics and heterogeneous integration (CSP&HI). This free one-day workshop and networking event consists of oral and poster presentations, panel discussions. This workshop aims to bring interesting parties to share the advances, issues/challenges, and future directions from basic research to practical applications. While the theme is on CSP&HI, we also welcome presentations on all aspects of photonics, optics, and semiconductors. Regional and national collaborations will be explored. Workforce development and student education will also be discussed. Details and free registration link: (https://photonics.uta.edu/) Co-sponsored by: UTA Photonics Center, UTA College of Engineering, IEEE Fort Worth Chapter, IEEE Photonics Society Fort Worth Chapter, Optica Agenda: (https://photonics.uta.edu/) 8:20-10:00 Session I: Heterogeneous integration 8:20-8:30 Welcome and logistics Dean Peter Crouch UTA College of Engineering 8:30-9:00 Invited: Heterogeneous Integration Trends and Their Implications for Photonics Roy Meade Texas Institute for Electronics 9:00-9:30 Invited: Diamond integration with 2D and other semiconductor materials for developing energy efficient devices Dr. Anirudha Sumant Argonne National Laboratory 9:30-9:45 Thermal and Mechanical Challenges in Co-packaging of Si-III/V components in Silicon Photonics Prof. Dereje Agonafer UTA 9:45-10:00 UTA Photonics Center Overview and heterogeneous photonic crystal platform Prof. Weidong Zhou UTA 10:00-10:30 Coffee break 10:30-12:30 Session II: Chip-scale photonics 10:30-11:15 Keynote: Silicon Photonics with Integrated Lasers and Amplifiers for Next-Gen Optical I/O Dr. Haisheng Rong Intel 11:15-11:45 Invited: Photonic Dirac Waveguides Dr. Jeffery Allen Air Force Research Laboratory 11:45-12:00 Coherent ring VCSELs for high power, narrow linewidth applications Dr. Luke Graham Dallas Quantum Devices 12:00-12:15 Introduction of TI Optical Sensor Products Dr. Wenjuan Fan Texas Instruments 12:15-12:30 EQuIP Lab: Toward High-Performance Photonic Devices (Detectors) Prof. Seunghyun (Jacob) Lee UTA 12:30-13:30 Lunch and poster session 13:30-15:30 Session III: Advanced theory, materials, and devices 13:30-14:00 Invited: Group Theory based Mode Engineering for Nonlinear Parametric Conversion Dr. Ihab El-Kady Sandia 14:00-14:15 Electromagnetic metamaterials: Principles and applications Prof. Robert Magnusson UTA 14:15-14:45 Selenides of refractory niobium and tungsten: towards light-mediated quantum sensors and renewable energy devices Prof. Anupama Kaul UNT 14:45-15:00 Direct Measurement of Thermal Conductivity with Time-Resolved Thermal-Radiation Spectroscopy Prof. Yuzhe Xiao UNT 15:00-15:15 Plasmonic Nanopore Sensing with AC Current Modulation to Enable Quality Control in Biomanufacturing Prof. Georgios Alexandrakis UTA 15:15-15:30 Optical imaging systems for cardiovascular applications Prof. Yichen Ding UTD 15:30-16:00 Wrap-up discussions: Chip-Scale Semiconductor Photonics and HI challenges and opportunities 16:00-17:00 Poster session, social interactions, and lab tours UTA, UT Arlington, Arlington, Texas, United States, 76019

Join us every second Friday at 11AM CTS for an exciting series of technical presentation specifically designed for IEEE Young Professionals. This series will provide valuable insights into cutting-edge technologies, industry trends, and practical solutions to challenges faced in many sectors such as electrical, energy, electronics, etc.. Network with your peers, learn from subject matter experts, and learn something new outside of your career path! Creating a More Reliable Grid Through Distribution Automation: Reconfiguration, Volt-Var & Design: This talk discusses the integration of Automated Circuit Support and Volt Var Optimization (VVO) in distribution utility systems to improve grid reliability, efficiency, and power quality. Circuit Support focuses on reducing the duration and frequency of outages by enabling automated switching operations among nearby circuits during fault events. This system utilizes equipment with real-time fault detection and automated responses like back feeding to restore power to affected zones. The benefits of automated circuit support include reduced outage times and reliability in the electric utility grid. VVO enhances system performance by optimizing the voltage and lower reactive power (VAR) levels to reduce energy loss throughout the circuit. The importance of maintaining a low VAR-to-real power ratio is highlighted, particularly in mitigating the impact of inductive loads from industrial and residential sources. Autumn will also outline the process of designing and constructing distribution systems, including structural analysis, wooden utility poles, and line reconfiguration. The combination of these projects leads to a more efficient and resilient electrical grid, capable of better serving customers while minimizing the impact of outages and improving power quality. Speaker(s): Autumn Vargo, Virtual: https://events.vtools.ieee.org/m/462134

Monthly meeting of EMB Chapter, followed by a technical talk There is a $15.00 charge for each registrant. Guests and non-members charge is $20.00 and Students are $5.00. Remainder of the tab will be picked up by the EMB. Agenda: 11:30am: Business meeting: Call to order, minutes of last meeting, treasurer's report, new business, 12:00pm: Lunch 12:30pm: Technical talk and discussion 1::00pm: adjourn San Antonio, Texas, United States

IEEE Denver Computer, Information Theory & Robotics Society, Computational Intelligence Society, and Colorado School of Mines – Joint Technical Meeting (triple event). February 14, 2024, 4:00 PM – 5:00 PM (MDT) Thong Quoc (Bill) Huynh Presentation: Reduced Dimensionality of State Space: Faster Motion Planning and Infeasibility Proofs. Jonathan Diller Presentation: Path-Finding for Energy-Sharing Drone-UGV Teams. Dr. Frankie Zhu Presentation: Autonomous Robots Traversing Space Environments. Location: Colorado School of Mines Marquez Hall, room 126 Parking: Free street parking along Washington Ave and parts of 16th, 17th, and Arapahoe streets (look for City of Golden signs, parking on campus streets requires a permit). Paid parking is available at 940 18th St, Golden, CO 80401. Invited: Colorado School of Mines and IEEE CIR & CIS society members. Cost: Free Speaker(s): , , Room: 126, Bldg: Marquez Hall, 1600 Arapahoe St, Golden, CO 80401, Colorado, United States, 80401