Kickoff meeting for ExCom. Tentative Agenda: Introductions Financial reporting for 2024- Bob PSD for 2025 Region 5 Congress and Student Competitions in in Wichita, Kansas, March 28-30. Process for approving sponsoring requests from members New Initiatives Others ( please send other agenda items.) Virtual: https://events.vtools.ieee.org/m/463516
Learn the Basics of Git and Github. Dive into the commands use for git. Ideal workflow when using Github Room: 1.202, Bldg: Applied Engineering Technology, 1 UTSA Circle, San Antonio, Texas, United States, 78249
Come network with Houston area electrical engineering professionals and meet the candidates for section officers! Enjoy food and drinks courtesy of our sponsor while you meet the candidates ask them about their plans for the Houston section. Be sure to let them know your opinions and desires for the section for the next year. There are four positions being elected: Chair, Vice-Chair, Secretary, and Treasurer. The election for the IEEE Houston section officers will take place from February 5th to 20th, so you can cast your vote the same day. Big thanks to our sponsor: [] The Lynn Elliott Company (LECO) has over 80 years of experience representing the Southwest for manufacturers in the Electrical Power Industries. The reason for LECO's sustainability has to do with its core philosophy: it's not about the sale – its about the quality of the relationship. We take pride in understanding our manufacturers' products at such a high level that we offer expertise and knowledge beyond the sale. That is why our customers continue to rely on our services and why manufacturers choose us. Co-sponsored by: Lynn Elliott Company Agenda: We'll be there from 5pm to 7pm, and feel free to show up and leave whenever is convenient. Bldg: Kirby Ice House, 1015 Gessner Rd, Houston, Texas, United States, 77055
See agenda below. Agenda: Agenda Virtual: https://events.vtools.ieee.org/m/463086
Baton Rouge IEEE Section Technical meeting Presentation topic is “Power Factor Correction” Co-sponsored by: IAS, ISA, WIE Speaker(s): Nick Losito, Agenda: 6:00 pm - 6:30 pm Social 6:30 pm - 7:30 pm Presentation Bldg: LaContea Italiano Ristorante, 7970 Jefferson Hwy., Baton Rouge, Louisiana, United States, 70809
Title: Interconnection Scaling – Going Big and Going Small Abstract: This presentation will cover a high-level overview of interconnections between integrated circuits – trends over the past several decades and what technologies may support future trends, along with a discussion of basic signal integrity considerations for such interconnections. Over most of the past 50 years the scaling of silicon integration was the winning hand for increased performance with packaging and interconnections scaling at substantially lower rates. Fundamental challenges in nanometer process nodes have effectively ended the steadily increasing benefits of Moore’s Law so new paradigms for 2D, 2.5D, and 3D Heterogeneous Integration packaging technologies are being proposed and developed to keep system performance scaling moving forward. Rapidly moving a lot of data between chips is fundamental to all these approaches. One approach for dense, high bandwidth interconnections will be discussed in some detail to illustrate tradeoffs and discuss the limits of how interconnections between chips can reach the limits of interconnections within chips. Co-sponsored by: University of Colorado Boulder Agenda: 6:30PM - 7:00PM Social 7:00PM - 8:00PM Technical Talk Room: KOBL 352, Bldg: Rustandy Building, 1111 Engineering Dr, Boulder, Colorado, United States, 80309
