2025 Build-Up Substrate Symposium

Pre-BUSS Tutorials

  • On-demand (2 hours):
  • On-demand (1 hour):

    FINAL PROGRAM for BUSS’24: view last year’s program

    Accepted Presentations to Date
    Speaker Title/Abstract
    Keynote Talk: Omar Bchir, Qualcomm Next Generation Organic Substrate Technology: How Will it Synergize with 2.5D?
    — (to be provided) … (more)
    Yuya Suzuki, Taiyo America Dry-film Solder Resist Materials for High Density IC Substrates
    — The demand for high-density integrated circuit (IC) substrates is driving advancements in material technologies to meet the increasing complexity and performance requirements of high-performance electronics. Solder resist (SR) materials play a critical role in IC substrate applications by providing insulation and protecting circuit patterns… (more)
    Hikaru Mizuno, JSR Micro Advanced Photo-imageable Dielectric Film Enabling Sub-5-micron Patterning for Next Generation Build-up Layer
    — As novel electronic products become dramatically smaller and more highly functionalized, semiconductor packaging structures are also required to become smaller, thinner and more complicated. Based on these market trends, the IC substrate has become one of the most important components in packaging. Next-generation build-up layer patterning materials for IC substrates are required to meet the demands of ultra-fine via patterning… (more)
    Dr. Debendra Das Sharma, Data Platforms and Artificial Intelligence Group, Intel Fellow UCIe 2.0: Open Chiplet Innovation Continues with Vertical and Planar Connectivity
    — (to be provided) … (more)
    Shiro Tatsumi, Ajinomoto Advanced Insulation Material for High Performance Semiconductor Packages
    — Printed circuit boards such as multi-layer printed wiring boards and flexible printed wiring boards are used for a wide variety of electronic devices. Ajinomoto Build-up Film®(ABF) has been widely utilized for a variety of package structures due to its outstanding insulation reliability, good resin flow, thickness uniformity and Semi-Additive Process (SAP) compatibility for fine line and space formation. Low coefficient of thermal expansion (CTE) … (more)
    Vern Stygar, AGC Glass Compositions for Data Centers, AI, and Quantum Computing
    — The use of glass as a core material for electronic and photonic packaging substrates is being considered due to its rigidity, flatness, and dimensional stability for advanced packaging such as chiplet packaging requiring large format and high-density interconnection. This presentation will provide an overview of glass material technology, processing technology and the need for reliability testing for glass core substrates … (more)
    Masa Fukui, Resonac America, Inc. Substrate Materials for Advanced Packaging
    — The development of advanced packaging technology has been accelerated, such as for 2.5D packaging and chiplet design. Advanced packaging requires HSIO, high density interconnection and large form factor. This motivation for future packaging is the driving force behind the development of substrate materials to meet the challenges. In this perspective, glass substrates are considered as the future generation substrate … (more)