IEEE SA EMC Webinar Series

ELECTROMAGNETIC COMPATIBILITY WEBINAR SERIES

Augmented Intelligence

for E2E Design Webinar

06 February 2025 | 12:00 PM - 1:00 PM EST

The IEEE Electromagnetic Compatibility (EMC) Society and IEEE Standards Association are hosting a series of webinars to create awareness of some trending topics related to reducing electromagnetic interference in areas such as automotive technologies, consumer electronics, wireless communications, and 5G. Registering for the webinar series gives you access to the most recent webinar recording and all future webinars.

UPCOMING SESSION

Augmented Intelligence for E2E Design

Chiplet and disaggregated designs are increasingly prevalent in commercial offerings from edge to server. However, the associated design complexity poses a significant challenge for today’s design tools, flows and methodologies, especially if we aim to achieve highly optimized design at scale.

Augmented Intelligence, combining human and machine intelligence, offers a transformative solution to support multi-level and multi-domain design optimization. By strategically assigning high-level decision-making to humans and iterative computations to Artificial Intelligence, this methodology can scale the number of custom-optimized designs with the same number of resources, achieving high-quality competitive products with reduced time-to-market.

Through collaborations at Intel and with partners, we have developed and deployed Augmented Intelligence solutions spanning silicon to system design and hardware to software design, achieving design efficiency gains exceeding 90% in critical areas. This talk will present practical examples and key learnings from several years of developing Augmented Intelligence solutions for end-to-end design.

This event features the following standards:

IEEE 1848™: Learn more | Purchase

IEEE P1848.1™: Learn more

REGISTER FOR THE SERIES

WEBINAR SPEAKER

Dr. Olena (Jianfang) Zhu

Chief Architect for AIPC ecosystem and AI for design within Client Computing Group at Intel Corporation

Dr. Olena (Jianfang) Zhu defines the scaling strategy for the AIPC ecosystem, fosters collaborations with industry partners, and develops innovative use cases to enhance productivity across various industry verticals.

Recognizing the transformative potential of Augmented Intelligence (AuI: AI + human experts) in 2019, Dr. Zhu spearheaded a corporate-wide initiative to revolutionize silicon/platform design tools and methodologies. By leading cross-functional teams at Intel and academia, she developed and deployed multiple AuI tools, significantly reducing design time by up to 90% in critical design areas.

Dr. Zhu is also an Adjunct Professor in Electrical Engineering at Purdue University where she earned her Ph.D. in 2011. Drawing on her deep expertise in AI and extensive industry experience, she actively contributes to shaping the AI-for-design research programs and initiatives. Additionally, she mentors and guides students, inspiring them to pursue innovative research and careers in AI. Dr. Zhu has authored 50+ papers in refereed journals & conferences. She has 35+ U.S. patents. Her groundbreaking work in AI-based design tools has garnered significant recognition, including features on social media in 2024. Dr. Zhu's accomplishments have been honored with the 2021 Society of Women Engineers Emerging Leader Award, the 2020 Intel IAA Award (top company award), and the 2018 Outstanding Industry Liaison Award from the Semiconductor Research Corporation.