Dustin Kendig, Co-Founder and Vice President of Microsanj LLC in Santa Clara, California

In-Person Meeting. Register: Here

Thermal Analysis for Thermal Challenges with Heterogeneous Packaging

With the commercialization of thermoreflectance thermal imaging, Microsanj has met many of the thermal challenges inherent with today’s advanced devices. The thermoreflectance principle exploits the fact that the reflectivity of a material changes with temperature. By measuring the reflectivity change with probing wavelengths in the visible band, this technique supports thermal measurements with diffraction-limited spatial resolution in the sub-micron range and a temporal response in the nanosecond range. New thermal analysis challenges are arising with current trends and advances in heterogeneous packaging techniques. To address these new challenges, Microsanj is developing enhancements and new products. A brief description of these techniques, including optical pump-probe imaging, flash thermography, over-the-air imaging for the analysis of embedded antennas, and other approaches being investigated, will be provided in this presentation.
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About the Author

Dustin Kendig, Co-Founder and Vice President of Microsanj LLC

Dustin Kendig is Co-Founder and Vice President of Microsanj LLC in Santa Clara, California. He received his B.S. Degree with Honors in Electrical Engineering from the University of California, Santa Cruz. At Microsanj he is developing sub-micrometer transient thermal imaging systems for the semiconductor industry for thermal characterization and fault isolation. Microsanj has 75+ commercial products and research partnerships with companies and research labs in a dozen countries. He is a member of the IEEE Instrumentation and Measurement and Reliability Societies. In 2009, he was the recipient of the Huffman Prize, Dean’s Award, and Chancellor’s Award. He won best poster at IEEE PVSC in 2010 and best paper at IEEE ITherm in 2017. He holds four patents and has published over sixty papers.

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