Second Annual IEEE Build-Up Substrate Symposium (BUSS)

#heterogeneous #integration #build #up #substrate #onshoring

We are living in the era of heterogeneous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced with 3D heterogeneous integration of chiplets onto a platform made of an organic build-up substrate. Volume manufacturers of build-up substrates are entirely based in Asia, leaving a desert in the US. Volume build-up substrates used by major IDMs are manufactured in Asian countries including Taiwan, Japan and China.
However, there are multiple activities starting up in the US, and this is why a gathering of the US players is important. This symposium is geared for all those involved in the supply chain of build-up substrates in the US, as well as users. This Symposium is an opportunity for all build-up substrate players to meet, network and cohesively work with funding agencies who will be invited to this symposium to focus on onshoring build-up substrate production and utilization.

• Start time: 08 May 2025 08:00 AM
• End time: 09 May 2025 05:00 PM
• All times are (UTC-07:00) Pacific Time (US & Canada)
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• SEMI World Headquarters
• 673 South Milpitas Blvd
• Milpitas, California
• United States 95035

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• Starts 21 January 2025 12:00 AM
• Ends 09 May 2025 12:00 AM
• All times are (UTC-07:00) Pacific Time (US & Canada)
• Admission fee ?

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Sessions:
— Substrate Manufacturing and Onshoring
— Materials for Substrates
— Emerging Substrate Technologies
— Panel Equipment and Technologies for Substrates
— Inspection and Testing
    … plus two panels:
— Substrate End Users
— Onshoring and Startups