Dr. Bond of Iowa State University & IEEE

Cold electronics is a key technology in many areas of science and technology including space exploration programs and particle physics. The Deep Underground Neutrino Experiment (DUNE) uses liquid Argon at ~ 87 K as a target material for neutrinos and its sensors will consist of about 24,000 custom-designed ASIC (Application Specific Integrated Circuits) which are required to be immersed in liquid argon for 20-30 years. Various inspection technologies, including both x-ray and ultrasound are being considered to ensure chip QA/QC. One activity is the design, use and data analysis for a novel low-cost cryogenic acoustic microscope (CryoSAM) which has been developed and used to evaluate reliability issues of ASICs. Cryogenic acoustic microscopy in itself is not new: a GHz frequency unit was reported by a Stanford University group in the 1980’s. This talk will report on the development of a CryoSAM operate to frequencies of about 50 MHz and demonstrate its potential for reducing the risk of sensor failure during DUNE operation.

Biography:

Dr. Bond graduated with his Ph.D. in Physics, in 1978, from the City University London. He has experience as an academic, in industry and national laboratories. Most recently he was a Professor at Iowa State University in both Aerospace and Mechanical Engineering. He retired in 2022 and continues as a Professor Emeritus to be active in research as a consultant, including with Sonogen Medical Inc. His previous positions include being a Laboratory Fellow with Pacific Northwest National Laboratory (PNNL), a Research Professor, University of Colorado, Boulder and Reader in Ultrasonics, University College London. He is an Honorary Professor, Beijing, University of Technology (BJUT). Dr. Bond is a Fellow of the American Association of the Advancement of Science, a Fellow of the Institute of Physics (UK), and a Life Senior Member of the IEEE. In 2009-10 he served as Director IEEE Region 6, and a member of the IEEE Board of Directors. He is currently the Chair of the Life Member Affinity Group (LMAG), IEEE Richland Section. Dr. Bond has been an invited speaker at many national and international meetings. He has been author or co-author for 19 books (most as editor), including the 2024 4th Edition of the book, Ultrasonics (D. Ensminger and L.J. Bond), 23 book chapters, more than 90 peer reviewed journal papers and more than 220 papers in conference proceedings. He holds 10 patents.

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