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Tiwei Wei

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Process Development and Reliability Investigations for Scaling 3D Interconnects in Advanced Semiconductor Packaging
01 Sep 2024

Process Development and Reliability Investigations for Scaling 3D Interconnects in Advanced Semiconductor Packaging

1.00 pdh
  • EPS
    Members: Free
    IEEE Members: $11.00
    Non-members: $15.00
Tutorial: Thermal Challenges for Heterogeneous Integration Packaging
02 Nov 2023

Tutorial: Thermal Challenges for Heterogeneous Integration Packaging

1.00 pdh
  • EPS
    Members: Free
    IEEE Members: Free
    Non-members: Free