ERIC Number: EJ1424127
Record Type: Journal
Publication Date: 2024-Mar
Pages: 13
Abstractor: As Provided
ISBN: N/A
ISSN: ISSN-0271-0560
EISSN: EISSN-1536-0741
College Credit Plus Modality and Future Matriculation of High School Students in Ohio
New Directions for Higher Education, n205 p5-17 2024
College Credit Plus (CCP) is a dual enrollment program allowing high school students to obtain both high school credit and college credit by participating in college courses at a local higher education institution. CCP courses can be taken at a college or university, at the student's high school, or online. This research seeks to find if CCP course modality affects future matriculation to the same university following high school. The population of CCP student data was a historical sample collected from the spring semester of 2018 to avoid the influence of COVID-19 on attendance. Data on the location of CCP courses that the student was enrolled in and whether the student chose to attend the university beyond high school were collected. Chi-square and the post hoc test, Cramer's V, were used to analyze the data, resulting in a significant association between CCP course modality and future university matriculation. CCP student proximity and familiarity with the university campus may influence the choice to remain at the same institution after high school graduation. These findings can be used to direct further CCP research with a wider scope.
Descriptors: Dual Enrollment, College Credits, High School Students, In Person Learning, Electronic Learning, Campuses, College Choice, Admission (School)
Wiley. Available from: John Wiley & Sons, Inc. 111 River Street, Hoboken, NJ 07030. Tel: 800-835-6770; e-mail: cs-journals@wiley.com; Web site: https://bibliotheek.ehb.be:2191/en-us
Publication Type: Journal Articles; Reports - Research
Education Level: High Schools; Secondary Education; Higher Education; Postsecondary Education
Audience: N/A
Language: English
Sponsor: N/A
Authoring Institution: N/A
Identifiers - Location: Ohio
Grant or Contract Numbers: N/A