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ERIC Number: EJ1375998
Record Type: Journal
Publication Date: 2023-Jun
Pages: 24
Abstractor: As Provided
ISBN: N/A
ISSN: ISSN-1571-0068
EISSN: EISSN-1573-1774
Elementary Students' Engineering Design Process: How Young Students Solve Engineering Problems
Sung, Euisuk; Kelley, Todd R.
International Journal of Science and Mathematics Education, v21 n5 p1615-1638 Jun 2023
With the increasing importance of teaching STEM to young students, the engineering design process (EDP) has become a popular learning platform in K-12 STEM education. The engineering design process guides students in solving engineering problems, but there is a lack of understanding of how students utilize this process. In this study, we explored how iterative design activities form procedural patterns of the engineering design process using sequential analysis. We videotaped 48 engineering design sessions via the Concurrent Think-Aloud (CTA) protocol from elementary students grades 3-6 in the USA. The data was coded using Halfin's codes. The sequential analyses identified the statistical significance of patterns from the repetitive design activities. The results indicate (1) there were two iterative recursions in the problem and solution phases, (2) questioning was a gateway to designing, (3) modeling and predicting occurred with designing, and (4) managing bridged the problem and solution phases. The study also found that different design contexts yield distinctive procedural patterns. This result implies that engineering educators need to understand the proper use of the design process model.
Springer. Available from: Springer Nature. One New York Plaza, Suite 4600, New York, NY 10004. Tel: 800-777-4643; Tel: 212-460-1500; Fax: 212-460-1700; e-mail: customerservice@springernature.com; Web site: https://bibliotheek.ehb.be:2123/
Publication Type: Journal Articles; Reports - Research
Education Level: Elementary Education; Early Childhood Education; Grade 3; Primary Education; Grade 4; Intermediate Grades; Grade 5; Middle Schools; Grade 6
Audience: N/A
Language: English
Sponsor: National Science Foundation (NSF)
Authoring Institution: N/A
Grant or Contract Numbers: DUE0962840