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A Hands-On Freshman Survey Course to Steer Undergraduates Into Microsystems Coursework and Research | IEEE Journals & Magazine | IEEE Xplore

A Hands-On Freshman Survey Course to Steer Undergraduates Into Microsystems Coursework and Research


Abstract:

Full class loads and inflexible schedules can be a significant obstacle in the implementation of freshman survey courses designed to guide engineering students into emerg...Show More

Abstract:

Full class loads and inflexible schedules can be a significant obstacle in the implementation of freshman survey courses designed to guide engineering students into emerging research areas such as micro- and nanosystems. A hands-on, interactive course was developed to excite freshmen early in their engineering program to pursue research and careers in microsystems. The course focused on the top-down and bottom-up approaches to building devices, including the metrology tools required for visualization and characterization at the micro- and nanoscales. Modular lab components required students to interact with, build, and characterize microsystems. Macroscale versions were used to teach microscale concepts. An introductory module included dissecting the iPod Mp3 player, understanding its macroscale components and inspecting the microscale components in optical and scanning electron microscopes (SEM). A summary of the class focus and lab exercise modules is reported.
Published in: IEEE Transactions on Education ( Volume: 52, Issue: 3, August 2009)
Page(s): 312 - 317
Date of Publication: 05 May 2009

ISSN Information:

Department of Bioengineering, University of Utah, Salt Lake, UT, USA
Mark A. Eddings received the undergraduate degree in mechanical engineering from the University of Utah, Salt Lake City, in 2004.
Currently, he is a doctoral student in bioengineering at the University of Utah. While working on his undergraduate degree, he worked as an Engineering Intern for Medron, a medical device manufacturing company, specializing in percutaneous catheters and other related devices. He has been an NSF ...Show More
Mark A. Eddings received the undergraduate degree in mechanical engineering from the University of Utah, Salt Lake City, in 2004.
Currently, he is a doctoral student in bioengineering at the University of Utah. While working on his undergraduate degree, he worked as an Engineering Intern for Medron, a medical device manufacturing company, specializing in percutaneous catheters and other related devices. He has been an NSF ...View more
Department of Electrical Engineering, University of Utah, Salt Lake, UT, USA
James C. Stephenson received the B.S. degree in electrical engineering from the University of Utah, Salt Lake City, in 2002.
He is a Doctorate student with the Electrical and Computer Engineering Department, University of Utah. His educational focus was on the fundamental science associated with the semiconductor industry, concentrated on fabrication process design and implementation. He also worked for Bourns Microelectro...Show More
James C. Stephenson received the B.S. degree in electrical engineering from the University of Utah, Salt Lake City, in 2002.
He is a Doctorate student with the Electrical and Computer Engineering Department, University of Utah. His educational focus was on the fundamental science associated with the semiconductor industry, concentrated on fabrication process design and implementation. He also worked for Bourns Microelectro...View more
Nanofabrication Facility, College of Engineering, University of Utah, Salt Lake, UT, USA
Ian R. Harvey received the Ph.D. degree in 1990 from the Colorado School of Mines, Golden.
He joined the University of Utah, Salt Lake City, in 2002 from the semiconductor industry, where he was a microscopist, failure analyst, process development engineer, and MEMS product development engineer, then he became a package development and reliability engineer over a 10-year period with two companies (VLSI Technology Inc., Bou...Show More
Ian R. Harvey received the Ph.D. degree in 1990 from the Colorado School of Mines, Golden.
He joined the University of Utah, Salt Lake City, in 2002 from the semiconductor industry, where he was a microscopist, failure analyst, process development engineer, and MEMS product development engineer, then he became a package development and reliability engineer over a 10-year period with two companies (VLSI Technology Inc., Bou...View more

Department of Bioengineering, University of Utah, Salt Lake, UT, USA
Mark A. Eddings received the undergraduate degree in mechanical engineering from the University of Utah, Salt Lake City, in 2004.
Currently, he is a doctoral student in bioengineering at the University of Utah. While working on his undergraduate degree, he worked as an Engineering Intern for Medron, a medical device manufacturing company, specializing in percutaneous catheters and other related devices. He has been an NSF IGERT Fellow, a Research Assistant for the Utah State Center of Excellence for Biomedical Microfluidics, and is currently working as a Biomedical Engineer for Wasatch Microfluidics. His research interests focus on clinical applications of microfluidic immunoassays for therapeutic monitoring and point-of-care diagnosis. His previous research consisted of micropump development for lab-on-a-chip applications.
Mark A. Eddings received the undergraduate degree in mechanical engineering from the University of Utah, Salt Lake City, in 2004.
Currently, he is a doctoral student in bioengineering at the University of Utah. While working on his undergraduate degree, he worked as an Engineering Intern for Medron, a medical device manufacturing company, specializing in percutaneous catheters and other related devices. He has been an NSF IGERT Fellow, a Research Assistant for the Utah State Center of Excellence for Biomedical Microfluidics, and is currently working as a Biomedical Engineer for Wasatch Microfluidics. His research interests focus on clinical applications of microfluidic immunoassays for therapeutic monitoring and point-of-care diagnosis. His previous research consisted of micropump development for lab-on-a-chip applications.View more
Department of Electrical Engineering, University of Utah, Salt Lake, UT, USA
James C. Stephenson received the B.S. degree in electrical engineering from the University of Utah, Salt Lake City, in 2002.
He is a Doctorate student with the Electrical and Computer Engineering Department, University of Utah. His educational focus was on the fundamental science associated with the semiconductor industry, concentrated on fabrication process design and implementation. He also worked for Bourns Microelectronics, Ogden, UT, while finishing his undergraduate studies. During his tenure at Bourns, he developed processes for the batch fabrication of thin film electrical inductors. Upon completion of his undergraduate studies, he continued his work in process development with Micromem Technologies, Inc., at the Center for High Technology Materials in Albuquerque, NM. During the first three years of his graduate studies he worked as an NSF IGERT Fellow, where he had the opportunity to teach several classes and labs, further solidifying his desire to align his interests with academia. His research includes nuclear magnetic spectroscopy and numerical electromagnetics.
James C. Stephenson received the B.S. degree in electrical engineering from the University of Utah, Salt Lake City, in 2002.
He is a Doctorate student with the Electrical and Computer Engineering Department, University of Utah. His educational focus was on the fundamental science associated with the semiconductor industry, concentrated on fabrication process design and implementation. He also worked for Bourns Microelectronics, Ogden, UT, while finishing his undergraduate studies. During his tenure at Bourns, he developed processes for the batch fabrication of thin film electrical inductors. Upon completion of his undergraduate studies, he continued his work in process development with Micromem Technologies, Inc., at the Center for High Technology Materials in Albuquerque, NM. During the first three years of his graduate studies he worked as an NSF IGERT Fellow, where he had the opportunity to teach several classes and labs, further solidifying his desire to align his interests with academia. His research includes nuclear magnetic spectroscopy and numerical electromagnetics.View more
Nanofabrication Facility, College of Engineering, University of Utah, Salt Lake, UT, USA
Ian R. Harvey received the Ph.D. degree in 1990 from the Colorado School of Mines, Golden.
He joined the University of Utah, Salt Lake City, in 2002 from the semiconductor industry, where he was a microscopist, failure analyst, process development engineer, and MEMS product development engineer, then he became a package development and reliability engineer over a 10-year period with two companies (VLSI Technology Inc., Bourns Inc). His resume includes the acquisition and use of six SEMs, including one dual-beam FIB. He also developed MEMS architectures and packaging technologies for MEMS and discrete electronic products, holding 22 US patents. At the University of Utah, he is now the Associate Director of the Utah nanofab, a multiuser, open-access facility including tools for thin-film deposition and patterning, as well as surface analysis and nano imaging. He has taught courses in engineering creativity, teamwork, communication, ethics, and leadership, but now focuses on his project course in MEMS, another lab and lecture-based course in microsystems design and characterization, and a new lab-based course on practical scanning electron microscopy. He is the VP-Research in nFocus Inc., a MEMS company with former students from his class (“Tech Titans” winners); and a partner in an RFID livestock tracking company, Fort Supply Technologies, with his rancher-brothers.
Ian R. Harvey received the Ph.D. degree in 1990 from the Colorado School of Mines, Golden.
He joined the University of Utah, Salt Lake City, in 2002 from the semiconductor industry, where he was a microscopist, failure analyst, process development engineer, and MEMS product development engineer, then he became a package development and reliability engineer over a 10-year period with two companies (VLSI Technology Inc., Bourns Inc). His resume includes the acquisition and use of six SEMs, including one dual-beam FIB. He also developed MEMS architectures and packaging technologies for MEMS and discrete electronic products, holding 22 US patents. At the University of Utah, he is now the Associate Director of the Utah nanofab, a multiuser, open-access facility including tools for thin-film deposition and patterning, as well as surface analysis and nano imaging. He has taught courses in engineering creativity, teamwork, communication, ethics, and leadership, but now focuses on his project course in MEMS, another lab and lecture-based course in microsystems design and characterization, and a new lab-based course on practical scanning electron microscopy. He is the VP-Research in nFocus Inc., a MEMS company with former students from his class (“Tech Titans” winners); and a partner in an RFID livestock tracking company, Fort Supply Technologies, with his rancher-brothers.View more
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