Abstract:
This Special Issue of IEEE Journal of Solid-State Circuits highlights some of the outstanding circuit papers presented at the Symposium on VLSI Technology and Circuits. T...Show MoreMetadata
Abstract:
This Special Issue of IEEE Journal of Solid-State Circuits highlights some of the outstanding circuit papers presented at the Symposium on VLSI Technology and Circuits. The Symposium was held in person, June 11–16, 2023, in Kyoto, Japan.
Published in: IEEE Journal of Solid-State Circuits ( Volume: 59, Issue: 4, April 2024)
Systems Design Laboratory Graduate School of Engineering, The University of Tokyo, Tokyo, Japan
Mototsugu Hamada (Member, IEEE) received the B.S., M.S., and Ph.D. degrees in electronic engineering from The University of Tokyo, Tokyo, Japan, in 1991, 1993, and 1996, respectively.
In 1996, he joined Toshiba Corporation, Minato, Japan, and was engaged in wireless and low-power electronic circuit design with Toshiba’s Center for Semiconductor Research and Development, Kawasaki, Japan. From 2002 to 2004, he was a Visiting...Show More
Mototsugu Hamada (Member, IEEE) received the B.S., M.S., and Ph.D. degrees in electronic engineering from The University of Tokyo, Tokyo, Japan, in 1991, 1993, and 1996, respectively.
In 1996, he joined Toshiba Corporation, Minato, Japan, and was engaged in wireless and low-power electronic circuit design with Toshiba’s Center for Semiconductor Research and Development, Kawasaki, Japan. From 2002 to 2004, he was a Visiting...View more
Analog Devices Inc., Wilmington, MA, USA
Ron Kapusta (Senior Member, IEEE) received the B.S. and M.Eng. degrees from the Massachusetts Institute of Technology, Cambridge, MA, USA, in 2001 and 2002, respectively.
Upon graduation, he joined Analog Devices Inc., Wilmington, MA, USA, designing data converters and sensor interface circuits for digital imaging systems. From 2014 to 2019, he was with the Automotive Division, Analog Devices Inc., working on sensor interf...Show More
Ron Kapusta (Senior Member, IEEE) received the B.S. and M.Eng. degrees from the Massachusetts Institute of Technology, Cambridge, MA, USA, in 2001 and 2002, respectively.
Upon graduation, he joined Analog Devices Inc., Wilmington, MA, USA, designing data converters and sensor interface circuits for digital imaging systems. From 2014 to 2019, he was with the Automotive Division, Analog Devices Inc., working on sensor interf...View more
Contents Systems Design Laboratory Graduate School of Engineering, The University of Tokyo, Tokyo, Japan
Mototsugu Hamada (Member, IEEE) received the B.S., M.S., and Ph.D. degrees in electronic engineering from The University of Tokyo, Tokyo, Japan, in 1991, 1993, and 1996, respectively.
In 1996, he joined Toshiba Corporation, Minato, Japan, and was engaged in wireless and low-power electronic circuit design with Toshiba’s Center for Semiconductor Research and Development, Kawasaki, Japan. From 2002 to 2004, he was a Visiting Scholar with Stanford University, Stanford, CA, USA. From 2011 to 2016, he was with the Mixed Signal IC Division to lead the development of analog mixed-signal ICs. In 2016, he joined Keio University, Minato, and was a Project Professor. In 2020, he joined The University of Tokyo, where he is currently a Project Professor in the Systems Design Laboratory. His research interests include low-power, high-speed CMOS design, low-power wireless systems and circuits design, and power management systems design.
Dr. Hamada is a Senior Fellow of the Research Association for Advanced Systems (RaaS). He was a recipient of the 2007 IEEE International Conference on Computer Design (ICCD) Best Paper Award and the Design Automation Conference (DAC) 2010 Best User Track Poster Award. He was also recognized in the list of “Authors of Ten or More Papers in the Past Ten Years” at the International Solid-State Circuits Conference 2013 (ISSCC2013) and “ISSCC Authors With 20 or More Papers in the Past 70 Years” at ISSCC2023. He has served as a member for the Technical Program Committee of the International Solid-State Circuits Conference (2003–2009 and 2011), the VLSI Circuits Symposium (2018–2024), and the Asian Solid-State Circuits Conference (2005–2012 and 2017–2023), where he served as the RF Subcommittee Chair, the Digital Subcommittee Chair, the Student Design Contest Chair, and the Technical Program Committee Chair. He was a Technical Program Chair of the 2023 Symposium on VLSI Technology and Circuits. He is currently the Symposium Co-Chair of the 2024 Symposium on VLSI Technology and Circuits.
Mototsugu Hamada (Member, IEEE) received the B.S., M.S., and Ph.D. degrees in electronic engineering from The University of Tokyo, Tokyo, Japan, in 1991, 1993, and 1996, respectively.
In 1996, he joined Toshiba Corporation, Minato, Japan, and was engaged in wireless and low-power electronic circuit design with Toshiba’s Center for Semiconductor Research and Development, Kawasaki, Japan. From 2002 to 2004, he was a Visiting Scholar with Stanford University, Stanford, CA, USA. From 2011 to 2016, he was with the Mixed Signal IC Division to lead the development of analog mixed-signal ICs. In 2016, he joined Keio University, Minato, and was a Project Professor. In 2020, he joined The University of Tokyo, where he is currently a Project Professor in the Systems Design Laboratory. His research interests include low-power, high-speed CMOS design, low-power wireless systems and circuits design, and power management systems design.
Dr. Hamada is a Senior Fellow of the Research Association for Advanced Systems (RaaS). He was a recipient of the 2007 IEEE International Conference on Computer Design (ICCD) Best Paper Award and the Design Automation Conference (DAC) 2010 Best User Track Poster Award. He was also recognized in the list of “Authors of Ten or More Papers in the Past Ten Years” at the International Solid-State Circuits Conference 2013 (ISSCC2013) and “ISSCC Authors With 20 or More Papers in the Past 70 Years” at ISSCC2023. He has served as a member for the Technical Program Committee of the International Solid-State Circuits Conference (2003–2009 and 2011), the VLSI Circuits Symposium (2018–2024), and the Asian Solid-State Circuits Conference (2005–2012 and 2017–2023), where he served as the RF Subcommittee Chair, the Digital Subcommittee Chair, the Student Design Contest Chair, and the Technical Program Committee Chair. He was a Technical Program Chair of the 2023 Symposium on VLSI Technology and Circuits. He is currently the Symposium Co-Chair of the 2024 Symposium on VLSI Technology and Circuits.View more
Analog Devices Inc., Wilmington, MA, USA
Ron Kapusta (Senior Member, IEEE) received the B.S. and M.Eng. degrees from the Massachusetts Institute of Technology, Cambridge, MA, USA, in 2001 and 2002, respectively.
Upon graduation, he joined Analog Devices Inc., Wilmington, MA, USA, designing data converters and sensor interface circuits for digital imaging systems. From 2014 to 2019, he was with the Automotive Division, Analog Devices Inc., working on sensor interfaces for autonomous transportation, such as inertial MEMS and lidar. Since 2019, he has been focused on high-speed data converters for communications and radar systems. In 2019, he was elected a Fellow of Analog Devices Inc. He holds more than 40 issued U.S. patents.
Mr. Kapusta served as a member for the Technical Program Committee of the Custom Integrated Circuits Conference (2009–2014) and the Symposium on VLSI Circuits (2015–2024). He received the 2013 IEEE Journal of Solid-State Circuits Best Paper Award. He is currently a Technical Program Chair of the 2024 IEEE Symposium on VLSI Technology and Circuits.
Ron Kapusta (Senior Member, IEEE) received the B.S. and M.Eng. degrees from the Massachusetts Institute of Technology, Cambridge, MA, USA, in 2001 and 2002, respectively.
Upon graduation, he joined Analog Devices Inc., Wilmington, MA, USA, designing data converters and sensor interface circuits for digital imaging systems. From 2014 to 2019, he was with the Automotive Division, Analog Devices Inc., working on sensor interfaces for autonomous transportation, such as inertial MEMS and lidar. Since 2019, he has been focused on high-speed data converters for communications and radar systems. In 2019, he was elected a Fellow of Analog Devices Inc. He holds more than 40 issued U.S. patents.
Mr. Kapusta served as a member for the Technical Program Committee of the Custom Integrated Circuits Conference (2009–2014) and the Symposium on VLSI Circuits (2015–2024). He received the 2013 IEEE Journal of Solid-State Circuits Best Paper Award. He is currently a Technical Program Chair of the 2024 IEEE Symposium on VLSI Technology and Circuits.View more