This document describes an open standard for parts stress analysis and derating. It establishes uniform methods to increase a component’s reliability margin by decreasing the amount of applied stress (i.e., voltage, current, temperature, power, etc.) to an electronic, electrical, or electromechanical part. Reducing the stress levels improves device reliability/durability by reducing failure rates, thereby improving the reliability and availability of the product.

This specification establishes uniform methods for increasing a component’s reliability margin by decreasing the amount of applied stress (i.e., voltage, current, temperature, power, etc.) to an electronic, electrical, or electromechanical part.

The objective of stress analysis and derating is to improve product reliability by deliberately operating components at applied stress levels (i.e., voltage, current, temperature, power, etc.) that are below their rated capacity. Reducing the stress levels improves device reliability/durability by reducing failure rates, thereby improving the reliability and availability of the product.