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63055-2023 - IEEE/IEC International Standard--Format for LSI-Package-Board Interoperable design | IEEE Standard | IEEE Xplore

63055-2023 - IEEE/IEC International Standard--Format for LSI-Package-Board Interoperable design

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Abstract:

A method is provided for specifying a common interoperable format for electronic systems design. The format provides a common way to specify information/data about the pr...Show More
Scope:This standard defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit...Show More
Purpose:The general purpose of this standard is to develop a common format that LPB design tools can use to exchange information/data seamlessly, as opposed to having to work wit...Show More

Abstract:

A method is provided for specifying a common interoperable format for electronic systems design. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in the large-scale integration-package-board designs. The method provides the ability to make electronic systems a key consideration early in the design process; design tools can use it to seamlessly exchange information/data.
Scope:
This standard defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected. Collectively, such designs are referred to as LSI-Package-Board (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs.
Purpose:
The general purpose of this standard is to develop a common format that LPB design tools can use to exchange information/data seamlessly, as opposed to having to work with multiple different input and output formats.
Date of Publication: 19 October 2023
Electronic ISBN:979-8-8557-0216-3
Persistent Link: https://ieeexplore.ieee.org/servlet/opac?punumber=10287908

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